P.A. Agyakwa: search on Z-Library

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1

Degradation of thermal interface materials for high-temperature power electronics applications

Skuriat, R., Li, J.F., Agyakwa, P.A., Mattey, N., Evans, P., Johnson, C.M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 3.03 MB

english, 2013

2

Reliability of thick Al wire: A study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods

Arjmand, E., Agyakwa, P.A., Johnson, C.M.

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 2.20 MB

english, 2014

3

Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules

Yang, Li, Agyakwa, Pearl A., Johnson, C. Mark

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2013

Language:

english

File:

PDF, 941 KB

english, 2013

4

Applications-Based Design of SiC Technology

Wright, Nicolas G., Johnson, C.M., Horsfall, A.B., Buttay, Cyril, Vassilevski, Konstantin V., Loh, W.S., Skuriat, R., Agyakwa, P.

Journal:

Materials Science Forum

Year:

2009

Language:

english

File:

PDF, 310 KB

english, 2009

5

Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process

Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin, Johnson, Christopher Mark

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 2.36 MB

2020

6

Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling

P.A. Agyakwa, M.R. Corfield, L. Yang, J.F. Li, V.M.F. Marques, C.M. Johnson

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 1.81 MB

english, 2011

7

Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

J.F. Li, P.A. Agyakwa, C.M. Johnson

Journal:

Acta Materialia

Year:

2011

Language:

english

File:

PDF, 1.52 MB

english, 2011

8

A time-domain physics-of-failure model for the lifetime prediction of wire bond interconnects

L. Yang, P.A. Agyakwa, C.M. Johnson

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 556 KB

english, 2011

9

Suitable Thicknesses of Base Metal and Interlayer, and Evolution of Phases for Ag/Sn/Ag Transient liquid-phase Joints Used for Power Die Attachment

Li, J. F., Agyakwa, P. A., Johnson, C. M.

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 1.25 MB

english, 2014

10

Unusual Observations in the Wear-Out of High-Purity Aluminum Wire Bonds Under Extended Range Passive Thermal Cycling

Agyakwa, Pearl A, Corfield, Martin R, Jian Feng Li,, Wei-Sun Loh,, Liotti, Enzo, Hogg, Simon C, Johnson, C Mark

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2010

Language:

english

File:

PDF, 1.12 MB

english, 2010

11

Calibration of a Novel Microstructural Damage Model for Wire Bonds

Yang, L., Agyakwa, P. A., Johnson, C. M.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 832 KB

english, 2014

12

Relationship between gold and manganese mineralizations in the Birimian of Ghana, West Africa

Ntiamoah-Agyakwa, Y.

Journal:

Geological Magazine

Year:

1979

Language:

english

File:

PDF, 563 KB

english, 1979

13

A thermal cycling reliability study of ultrasonically bonded copper wires

Arjmand, Elaheh, Agyakwa, Pearl A., Corfield, Martin R., Li, Jianfeng, Mouawad, Bassem, Mark Johnson, C.

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 5.12 MB

english, 2016

14

Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement

Eleffendi, Mohd. Amir, Yang, Li, Agyakwa, Pearl, Mark Johnson, C.

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 2.41 MB

english, 2016

15

Damage Evolution in Al Wire Bonds Subjected to a Junction Temperature Fluctuation of 30 K

Agyakwa, Pearl A., Yang, Li, Arjmand, Elaheh, Evans, Paul, Corfield, Martin R., Johnson, C. Mark

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 8.65 MB

english, 2016

16

Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling

Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin, Johnson, Christopher Mark

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2018

Language:

english

File:

PDF, 4.31 MB

english, 2018

17

Characterization and solderability of cold sprayed Sn–Cu coatings on Al and Cu substrates

J.F. Li, P.A. Agyakwa, C.M. Johnson, D. Zhang, T. Hussain, D.G. McCartney

Journal:

Surface and Coatings Technology

Year:

2010

Language:

english

File:

PDF, 1.61 MB

english, 2010

18

A fixed-grid numerical modelling of transient liquid phase bonding and other diffusion-controlled phase changes

J. F. Li, P. A. Agyakwa, C. M. Johnson

Journal:

Journal of Materials Science

Year:

2010

Language:

english

File:

PDF, 532 KB

english, 2010

19

Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process

J.F. Li, P.A. Agyakwa, C.M. Johnson

Journal:

Acta Materialia

Year:

2010

Language:

english

File:

PDF, 1.56 MB

english, 2010

20

Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate

J.F. Li, P.A. Agyakwa, C.M. Johnson

Journal:

Journal of Alloys and Compounds

Year:

2012

Language:

english

File:

PDF, 1.95 MB

english, 2012

21

[IEEE 2009 International Semiconductor Device Research Symposium (ISDRS 2009) - College Park, MD (2009.12.9-2009.12.11)] 2009 International Semiconductor Device Research Symposium - A highly integrated high-voltage bi-directional switch

Solomon, A., Castellazzi, A., Hoyland, R., Agyakwa, P., Jianfeng Li,, Johnson, C.M.

Year:

2009

File:

PDF, 409 KB

2009

22

Room-Temperature Nanoindentation Creep of Thermally Cycled Ultrasonically Bonded Heavy Aluminum Wires

P.A. Agyakwa, V.M.F. Marques, M.R. Corfield, J.F. Li…

Journal:

Journal of Electronic Materials

Year:

2013

Language:

english

File:

PDF, 507 KB

english, 2013

23

A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds

Li, J.F., Agyakwa, P.A., Johnson, C.M.

Journal:

Year:

2013

Language:

english

File:

PDF, 1.14 MB

english, 2013

24

[IEEE 2010 International Power Electronics Conference (IPEC - Sapporo) - Sapporo, Japan (2010.06.21-2010.06.24)] The 2010 International Power Electronics Conference - ECCE ASIA - - High power density, low stray inductance, double sided cooled matrix-converter type switch

Castellazzi, A., Solomon, A., Agyakwa, P., Li, J., Trentin, A., Johnson, C. M.

Year:

2010

Language:

english

File:

PDF, 3.16 MB

english, 2010

25

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Computer simulation of crack propagation in power electronics module solder joints

Hua Lu,, Ridout, Steve, Bailey, Chris, Wei Sun Loh,, Pearl, Agyakwa, Johnson, Mark

Year:

2008

Language:

english

File:

PDF, 423 KB

english, 2008

26

[IEEE 2013 15th European Conference on Power Electronics and Applications (EPE) - Lille, France (2013.09.2-2013.09.6)] 2013 15th European Conference on Power Electronics and Applications (EPE) - Methodology for identifying wire bond process quality variation using ultrasonic current frequency spectrum

Arjmand, Elaheh, Agyakwa, Pearl, Johnson, C Mark

Year:

2013

Language:

english

File:

PDF, 599 KB

english, 2013

27

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module

Mattey, Nevil, Skuriat, Robert, Li, Jianfeng, Agyakwa, Pearl, Evans, Paul, Johnson, C Mark

Year:

2010

Language:

english

File:

PDF, 1.50 MB

english, 2010

28

Quantitative Microstructure Characterization of Ag Nanoparticle Sintered Joints for Power Die Attachment

Wang, Yun, Li, Jianfeng, Agyakwa, Pearl, Johnson, Christopher Mark, Li, Shuguang

Journal:

Molecular Crystals and Liquid Crystals

Year:

2014

Language:

english

File:

PDF, 888 KB

english, 2014

29

Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds”

Li, J.F., Agyakwa, P.A., Johnson, C.M.

Journal:

Year:

2015

Language:

english

File:

PDF, 204 KB

english, 2015

30

Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator

Arjmand, Elaheh, Agyakwa, Pearl A., Corfield, Martin R., Li, Jianfeng, Johnson, C. Mark

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 3.28 MB

english, 2016

31

Three‐dimensional damage morphologies of thermomechanically deformed sintered nano‐silver die attachments for power electronics modules

AGYAKWA, P., Dai, J., LI, J., MOUAWAD, B., YANG, L., CORFIELD, M., JOHNSON, C. M.

Journal:

Journal of Microscopy

Year:

2019

Language:

english

File:

PDF, 3.52 MB

english, 2019

32

Distribution, degree of damage and risk of spread of Trioza erytreae (Hemiptera: Triozidae) in Kenya

Aidoo, Owusu Fordjour, Tanga, Chrysantus Mbi, Mohamed, Samira Abuelgasim, Rasowo, Brenda Amondi, Khamis, Fathiya Mbarak, Rwomushana, Ivan, Kimani, Jackson, Agyakwa, Akua Konadu, Daisy, Salifu, Sétamou

Journal:

Journal of Applied Entomology

Year:

2019

Language:

english

File:

PDF, 1.44 MB

english, 2019

33

Distribution, degree of damage and risk of spread of Trioza erytreae (Hemiptera: Triozidae) in Kenya

Aidoo, Owusu Fordjour, Tanga, Chrysantus Mbi, Mohamed, Samira Abuelgasim, Rasowo, Brenda Amondi, Khamis, Fathiya Mbarak, Rwomushana, Ivan, Kimani, Jackson, Agyakwa, Akua Konadu, Daisy, Salifu, Sétamou

Journal:

Journal of Applied Entomology

Year:

2019

File:

PDF, 1.44 MB

2019

34

Lemon Terpenes Influence Behavior of the African Citrus Triozid Trioza erytreae (Hemiptera: Triozidae)

Antwi-Agyakwa, Akua K., Fombong, Ayuka T., Deletre, Emilie, Ekesi, Sunday, Yusuf, Abdullahi A., Pirk, Christian, Torto, Baldwyn

Journal:

Journal of Chemical Ecology

Year:

2019

Language:

english

File:

PDF, 958 KB

english, 2019

35

[IEEE 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) - Vienna, Austria (2020.9.13-2020.9.18)] 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) - Packaging degradation studies of High Temperature SiC MOSFET discrete packages

Mouawad, Bassem, Yang, Li, Agyakwa, Pearl, Corfield, Martin, Johnson, C. Mark

Year:

2020

File:

PDF, 1.83 MB

2020

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